SUSS Technology Forum at Semicon West

Industry experts will address the status of the 3D TSV infrastructure and recent advances in 3D processing... read more

Lithography Plus

SUSS MicroTec offers a broad product range to meet the different price and performance points required by the... read more

Excellence in Engineering – Built to Last!

Each and every remanufactured machine, SUSS MicroTec offers, meets our superior standards of quality and precision.... read more

Over 60 Years of Engineering Experience

SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than... read more

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About SUSS MicroTec

With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

News
19.06.2013
SÜSS MicroTec AG: 2013 Shareholders' Meeting in Munich
29.05.2013
Dow Corning and SUSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013
08.05.2013
Quarterly Figures for 2013 Published
07.05.2013
Ad hoc Release: Refocusing of the Permanent Bonding Product Line
17.04.2013
Environment friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool
28.03.2013
Ad hoc release: A World Leading IDM places a follow up order for Bonding-Equipment for 300mm High-Volume Production
28.03.2013
A World Leading IDM places a follow up order for Bonding-Equipment for 300mm High-Volume Production
28.03.2013
Final Figures for 2012 Fiscal Year Published
05.03.2013
Rolith and SUSS MicroTec Announce Installation of 2nd Generation Nanolithography Tool
14.02.2013
Preliminary Figures for 2012 Fiscal Year Published
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