SUSS MicroTec Receives Multiple Wafer Level Packing Equipment Orders from ASE
Munich, November 21st - SUSS MicroTec has received significant multiple orders for its lithography production equipment from the ASE Group, the world's largest provider of independent semiconductor manufacturing services in assembly and test. The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for 200 and 300mm, that will be installed at ASE’s wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.
Wafer level packaging is an advanced packaging technology whereby the die and 'package' are manufactured and tested on the wafer, then diced into individually packaged ICs. 300mm wafer level packaging technology is vital for continuous improvement in the quality and cost of high-technology products.
“Driven by market demands for faster, smarter, portable and integrated electronic products, we are increasingly moving towards more sophisticated semiconductor applications”, said D.Y. Chen, vice president of advanced packaging operations, ASE Kaohsiung. “Therefore, we have to rely on production equipment that enables high yields, coupled with unmatched throughput and cost effectiveness. SUSS MicroTec’s product offerings in lithography technology will enhance our success in providing wafer level packaging and wafer bumping services to our customers.“
“This repeat order from this key customer signals again that SUSS MicroTec’s high volume production spin coaters and mask aligners are setting the industry standards in advanced packaging," said Rolf Wolf, managing director of SUSS MicroTec Lithography Division. "It clearly establishes Lithography equipment from SUSS MicroTec as the tool of choice for wafer level packaging volume production applications.”
About ASE Group
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions, including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. The Group generated sales revenues of $3.1 billion in 2006 and employs over 28,000 people worldwide. For more information about the ASE Group, visit www.aseglobal.com.
