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Bonding Technology
Enabling Advanced MEMS Products and Integrated Electronics
MEMS manufacturing is migrating to advanced metal eutectic and diffusion bonds. SUSS offers a number of production wafer bonder platforms, ABC200, CBC200/300 and XBC300, that meet the needs of these advanced MEMS processes.
Features and Benefits
- High force with unrivaled pressure uniformity to within ±5% of setpoint
- Temperatures up to 600°C with the temperature uniformity needed to control diffusion bonding of metal hermetic seals
- Flexible Cluster Software that optimizes production throughput and has been proven on hundreds of installed clusters