print «back

Anodic Bonding

Anodic Bonding is used in MEMS processes whenever an ionic glass is used in the sensor fabrication. SUSS MicroTec aligner products include options for laser tacking and triple stack alignment which work in tandem with our bonders to realize many advanced products. During triple stack bonding three layers, glass/Si/glass, can be bonded simultaneously to increase functionality and throughput.

SUSS provides complete production and development tools for anodic applications. Our experience can help bring your anodic process to production capacity with proven fixture and process cluster options currently in 24/7 production operations around the world.

Main Markets