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SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience.
The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding as well as photomask cleaning equipment. It is complemented by specialised add-ons such as nanoimprint lithography tools and optical lenses.
The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like MEMS and LED appreciate our comprehensive experience in wafer processing. This make us a valuable partner for high-volume production as well as for research and development.
What's New At SUSS MicroTec
- 12/05/11 SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production
- 12/05/11 Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling
- 11/24/11 Cooperation of SUSS MicroTec and Swansea University’s Centre for NanoHealth
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