Coming to Taiwan for SEMICON Taiwan:
Thin Wafer Processing for 3D TSV Applications Workshop
Taipei International Convention Center - 102 Conference Room
Friday, Oct 2nd 2009, 9:00 to 13:00
This workshop discusses the current trends in 3D integration, highlighting the latest carrier wafer technology. Temporary wafer bonding and debonding have emerged as challenging processes necessary for most 3D integration schemes. The selection of the proper adhesive applied for temporary bonding is a key criteria. Electrical probing of 3D structures will also be introduced.
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Agenda
8:30-9:00 Registration |
 9:00-9:10 Welcome & IntroductionMr. Heinz Siegert, General Manager – SUSS MicroTec Taiwan |
 9:10-9:35 3D Technology with TSV: Challenges, Approach and Consolidation Dr. Robert Lo, Director Package Technology Division – ITRI |
 9:35-10:00 Cost Effective 3D System Integration Mr. Wim Sohier, Strategic Marketing Manager – Representative of IMEC Belgium |
10:00-10:25 Permanent and Temporary 3D Bonding & Electrical Probing for 3D StructuresMr. Jim Hermanowski, International Product Manager Wafer Bonder – SUSS MicroTec Inc. |
| 10:25-10:40 Coffee break |
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 10:40-11:05 3D SIP Packaging Trend, Challenges and OpportunityDr. Kuo-Chung Yee, Corporate R&D VP – ASE |
 11:05-11:30 3M™ Wafer Support System, Enabling Ultra-thin Wafer Handling (Temp. Bonding Process)Dr. Roger Chiu, Sr. Product Development Engineer – 3M |
 11:30-11:55 DuPont Wafer Level Packaging Materials Characterization for Thin Wafer ProcessingMr. Toshiaki Itabashi, WLP Applications Development Leader – DuPont |
 11:55-12:20 Wafer Support System for above 250 °C Back Side Processing and Cold De-BondingDr. Franz Richter, CEO – Thin Materials AG |
12:20-12:30 Questions and Answers |
| 12:30-13:20 Lunch |