News Archive 2005
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December
- 05/12/2005SUSS MicroTec Expands Training Facilities at German Headquarters
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November
- 28/11/2005SUSS Appoints MEMS Industry Veteran to Management Team
- 21/11/2005Unisem-Advanpack Technologies Selects SUSS MicroTec
- 11/11/2005SUSS MicroTec Introduces the PM300BEP Backside Emission Probe System
- 10/11/2005SUSS Wafer Bonding equipment selected for use in Purdue University's Birck Nanotechnology Center
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October
- 27/10/2005SUSS Receives 3 Production Wafer Bonder Orders
- 20/10/2005SUSS Introduces Port Mapping for SussCal® 6
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September
- 26/09/2005SUSS Introduces New LED Wafer-Level Bonding Technology
- 08/09/2005SUSS MicroTec Announces IBM Order for High Volume C4NP Bumping Line
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August
- 09/08/2005RoseStreet Labs Announces 3D & MEMs Packaging R&D Laboratory and Alliance with SUSS MicroTec
- 05/08/2005Installation of C4NP Lead-Free Bumping Equipment in Progress
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July
- 25/07/2005SUSS MicroTec Introduces the BlueRay Semiautomatic Probe System
- 20/07/2005SUSS MicroTec Unveils World's First Non-Contact Probe System
- 04/07/2005First C4NP Bumped Wafers Available for Viewing
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June
- 21/06/2005SUSS MicroTec Receives Strategic Order for new Production Aligner with Submicron Overlay Accuracy
- 20/06/2005SECAP Disbands After Successfully Achieving Goals
- 15/06/2005SUSS Introduces the Multi |Z| Probe® - World First: Testing with up to eight RF lines or mixed RF/DC on one probe
- 10/06/2005SUSS Introduces SussCal 6
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May
- 10/05/2005SUSS MicroTec Receives Strategic 300mm Order from Major Taiwanese Semiconductor Assembly and Test Facility
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April
- 29/04/2005SUSS MicroAlign now with ReAlign Function
- 06/04/2005SUSS MicroTec forms C4NP Business
- 04/04/2005SUSS MicroTec unveils the NPS300: An innovative NanoPatterning Stepper for cost effective volume production of nano-geometries
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February
- 24/02/2005SUSS MicroTec Consolidates Mask Aligner Production in Munich