Infotonics Selects SUSS Bonding Systems for MEMS Development Center
Munich, GERMANY, March 27th 2007 - SUSS MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced today that Infotonics, a collaborative, world class Center of Excellence in photonics and microsystems, has selected the SUSS ABC200 wafer bonding cluster tool and FC150 device bonder as strategic investments in their MEMS packaging lab.
With corporate partners such as Corning, Eastman Kodak, and Xerox, as well as relationships with over 20 universities, Infotonics has played a central role in groundbreaking work to benefit the biomedical and communications industries. Infotonics’ core competencies include the design, simulation, fabrication, packaging, test and metrology for MEMS and MOEMS devices. By using the facilities at Infotonics, customers can develop and deliver innovative products at reduced risk and cost, accelerating their time to market.
“The ABC200 and FC150 will be key components in our suite of core technologies for MEMS fabrication and packaging,” said Dr. Nancy Stoffel of the Infotonics Technology Center. “The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system. The ABC 200 cluster tool modularity allows us to run a variety of bonding processes for both R&D and pilot production.” For flip chip processes, the FC150 offers configurations from manual to full automation, providing development and pilot production capabilities on a single, upgradeable cost-effective platform.
“With its corporate and university partnerships and technology transfer initiatives, Infotonics is in a unique position to promote MEMS and MOEMS technology transfer to industry,” says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. “We are delighted to partner with them in their important work.”
SUSS MicroTec offers advanced wafer bonding solutions for the MEMS, SOI, 3-D interconnect, and Opto-Electronic markets. The SUSS ABC200 is a flexible modular cluster tool design that can integrate several process modules including wafer cleaning, plasma activation, precision wafer alignment, wafer bonding, and in-situ post-bond metrology all in a single system. The SUSS FC150 Automated Device Bonder incorporates a bi-directional microscope and high-precision mechanical stages to translate and rotate the parts during alignment. The FC150 offers best-in-class ± 1µm post-bond accuracy and a wide range of process capabilities to assemble MEMS and optoelectronic devices.
