SUSS Report
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Issue 01 / 2009
The latest SUSS Report offers you again a wide range of interesting topics. Check out our cover-story about the world of wafer-level cameras or browse through the product sections or find out more about Metal Eutecting Bonding Methods for the MEMS market – our engineering teams have put their heads together to provide you with hands-on information.
Process Solutions for Wafer Level Camera Manufacturing Made by SUSS MicroTec
Abstract
CMOS Image Sensors have led the way in the adoption of 3D interconnect using through silicon vias because of the enhancement in image quality and the reduction in size that is possible using this technology. 3D integration has enabled improvements in image sensor technology that would not otherwise be possible.
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CMOS Image Sensor Test at Wafer Level
Abstract
In the last few years, CMOS image sensors have conquered more and more applications in industry and automotive engineering. Optical test procedures provide valuable data to control processes more precisely and conserve resources.
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The SUSS MicroTec MA/BA8 Gen3 Mask Aligner - Enabling the Wafer Level Cameras
Abstract
The Wafer Level Camera (WLC) is a novel approach to manufacture low-cost CMOS cameras. The optical components are fabricated on glass wafers by Microlens Imprint Lithography (SMILE). Opto-Wafers and CMOS-Wafer are mounted by Wafer-Level Packaging (WLP). SUSS MicroTec has recently presented a new generation of Mask Aligners, the MA/BA8 Gen3 and an enhanced version of the highly successful MA200Compact.
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In the Spotlight – MA200Compact
Abstract
Mask aligners continue to be the system of choice for many existing and emerging technologies. Today the MEMS (Micro Electro Mechanical Systems), Advanced Packaging, Compound Semiconductor and Micro Optical Industry rely on mask aligner technology for production and process development alike. With the MA200Compact SUSS MicroTec has designed a new state-of-the-art mask aligner platform that has set standards in respect to alignment accuracy, high resolution, 3D patterning over topography and a new level of automation incl. SECSIIGEM interface.
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Clif‘s Notes - Would You Like to Swing Curve or DOE
Abstract
SUSS MicroTec's automated coater options such as ‘swing curve’ and ‘sequence stacking’ are very useful tools in search for optimum coating conditions. These options combined with the even more powerful capabilities of statistically designed experiments (DOE) will always enhance and improve the capabilities of SUSS coaters
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Enabling Next-Generation MEMS Devices with Metal Eutectic Bonding
Abstract
In the MEMS world, several substrate bonding techniques have been successfully applied in production. Each method has its advantages and disadvantages, owing to the material and processing costs, tolerance of manufacturing process variations process, and final device performance.
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The whole world of Nanoimprinting - and a unique feature more ...
Abstract
Nanoimprinting as “next generation” lithography was promoted already several years ago, focusing on mainstream semiconductor applications – and failed so far to overcome the most critical hurdles in semiconductor industry: defectivity. Contact in any sense is not a favorite processing technology step in this industry as particle transfer in any direction is a risk, reducing yield, thus profitability. Nevertheless, looking intensively into this technology a lot of advantages have been discovered and brought towards industrialization, like low cost nano patterning for a wide range of optical structures.
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