SUSS MicroTec in the News
December
- Dec 1Innovative minds in Advanced Packaging: SUSS MicroTec State of Art
October
- Oct 2IMEC Stacks the Deck on Memory Technologies
- Oct 13D IC technology drives public investment in 300mm
September
- Sep 28SUSS MicroTec banks on ATM in its new 3D probe station
- Sep 5SUSS Microtec Thin Wafer Processing 3D IC Workshop
August
- Aug 26IMEC/F-IZM/SUSS/TM vs. SEMATECH/Leti/EVG/Brewer.
- Aug 1Imaging Bonded Wafer Defects for 3-D
July
- Jul 28SUSS MicroTec workshop zeroes in on wafer thinning and handling issues
- Jul 203-D IC Technology Continues to Advance
June
- Jun 26SUSS MicroTec: A 3D Approach
- Jun 22SUSS MicroTec Bonders for Temporary and Permanent 3D Bonding Solutions
- Jun 1TSVs: just the tip of the 3D ICeberg
May
- May 27MPI collaborates with SUSS MicroTec on IC testing service
- May 20VLSI Research Institute: Customer Satisfaction Study - SUSS MicroTec is once again the highest rated Material Handling Equipment Supplier
- May 1Flip-Chip Packaging Becomes Competitive
April
- Apr 1SUSS MicroTec installs PhoeniX Software manufacturing execution system at MST.factory dortmund
January
- Jan 2Inside Wafer-Level Cameras
