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Organization
Corporate headquarters is the SÜSS MicroTec AG located in Garching near Munich, Germany. The group encompasses production sites as well as sales offices in Europe, North America and Asia.
Lithography solutions and wafer bonders represent the group’s core business. Highly accurate photolithography tools are produced by the Lithography Divison with a main focus on mask aligners and spin as well spray coaters. The Bonder Division is specialised in the development of production wafer bonders for high-volume packaging markets while also providing manual systems.
The Photomask Equipment Division HamaTech offers a superior suite of equipment solutions for photomask and imprint mask processing.
Furthermore, the solution portfolio of SUSS MicroTec for the semiconductor and related industries is complemented by specialised add-ons such as nanoimprint lithography tools and optical lenses.
