Come visit SUSS at SEMICON Taiwan 2008
Sep. 9 - 11, 2008 - Taipei World Trade Center, Hall I, Booth #1172
What's new at SUSS
BlueRay™ Probe System
Setting a new standard for high-speed accuracy, the BlueRay™ probe station is precisely the solution you need for wafer-level functional test of discrete devices. Conventional "pad-hoppers" offer speed, but at the cost of accuracy and reliability. The BlueRay prober overcomes these obstacles to offer you an accurate and reliable probe system and significant return on investment.
MA300 Production Mask Aligner
The latest generation of the SUSS MA300 Production Mask Aligner has been enhanced with an Alignment Kit dedicated to 3D-Packaging. The system allows for the creation of 3D interconnects for chip stacking and 3D image sensor packaging. The new 3D-Alignment tooling enables bottom side and infrared alignment for 300mm based 3-dimensional packaging lithography applications.
XBC300 CIS Wafer Bonder
The XBC300 Production Wafer Bonder provides the highest throughput with lowest cost of ownership for backside illuminated CMOS Image Sensor Manufacturing. At the core of the CIS cluster tool’s unmatched throughput capabilities is SUSS’ patented dual wafer single-station bond technology, which allows for 300mm cleaning, aligning and bonding to occur within a single process module.
ProbeShield® Technology
Presenting the next generation of ProbeShield® Technology for highly accurate device characterization and reliability measurements. New design features enhance the shielding effectiveness, ergonomics and mechanics to provide the most accurate probing solution available today. Alongside the new ProbeShield is the innovative new iVista™ High-Resolution Digital Imaging System.
CBC200 Production Bonding Cluster
Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 is a fully automated, best in class, wafer bond cluster with up to 90 kN bond force and 600°C thermal capacity. All standard MEMS fabrication processes as well as emerging eutectic, fusion, and metal diffusion bond technologies for integrated devices can be performed with low cost of ownership.
MA/BA8 Gen3
With the new MA/BA8 Gen3 Mask Aligner SUSS MicroTec addresses the growing demand for tighter process control coupled with high yield. Their ability to easily process virtually all kinds of wafer and substrate materials makes them ideally suited for operator assisted production environments. It also supports emerging applications like UV-Nanoimprinting and wafer level micro optics imprinting and assembly.
Photomasks
Image Technology, a subsidiary of SUSS MicroTec, offers photomasks from 4 to 14-inches, on quartz or soda lime. ITI is the only company that offers Mask Protection Technology. MPT was developed for mask aligners to reduce the exposure gap, thereby improving resolution and overlay accuracy.
Microlens Imprinting
New technologies such as microlens imprinting or optical lens stacking are increasingly used for production of high precision optics such as mobile camera applications. At Semicon Taiwan SUSS MicroTec will show a replicated 8" wafer from SUSS MicroOptics that has been imprinted on a SUSS MA/BA8 Mask Aligner. Kaleido Technology has kindly provided the corresponding master.
