Come visit SUSS at SEMICON West 2008
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What's new at SUSS
MA300 Plus
North Hall booth 5639
The MA300Plus Production Mask Aligner has been enhanced with a dedicated 3D-Packaging Alignment Kit for creating 3D interconnects for chip stacking and 3D image sensor packaging. The new 3D-Alignment tooling enables bottom side and infrared alignment for 300mm based 3-dimensional packaging lithography applications.
CBC200 Production Bonding Cluster
North Hall booth 5639
Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 is a fully automated, best in class, wafer bond cluster with up to 90 kN bond force and 600°C thermal capacity. All standard MEMS fabrication processes as well as emerging eutectic, fusion, and metal diffusion bond technologies for integrated devices can be performed with low cost of ownership.
Nano Imprint Technology
North Hall booth 5639
The capabilities of SUSS Mask Aligners are now enhanced with a new tooling for UV-NIL (nano imprint lithography), that enables to print resist thicknesses from less than 100nm to a few hundred microns with a printing resolution down to a few nanometers.
ProbeShield® Technology
West Hall booth 7311
Presenting the next generation of ProbeShield® Technology for highly accurate device characterization and reliability measurements. New design features enhance the shielding effectiveness, ergonomics and mechanics to provide the most accurate probing solution available today. Alongside the new ProbeShield is the innovative new iVista™ High-Resolution Digital Imaging System.
