Magazin für Kunden und Partner in englischer Sprache

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In dieser Ausgabe:

SUSS Excimer Laser

Excimer Laser Debonder for 2.5 and 3D Integration

SUSS MicroTec has recently introduced an Excimer Laser based Debonding module (ELD300), which allows the stress free separation of a glass carrier wafer that was bonded to a device wafer by means of an adhesive layer in order to support the device wafer during thinning or backside processing steps. Temporary bonding of device wafers to a carrier is typically used for supporting the device wafer during various critical process steps such as thinning and backside processing in area of 3D integration, 2.5D interposers, MEMS or power devices


Next-Generation Laser Structuring Method for Higher Density Packages

This article describes excimer laser ablation, a completely different approach to structuring organics that eliminates most of the drawbacks that our industry is now encountering with photolithography. Also discussed are key aspects of a turnkey stepper platform (the ELP300 from SUSS MicroTec) that is optimized specifically for advanced packaging applications, and that has already enabled several packaging houses to implement excimer laser ablation into their pilot lines


SUSS Smile Technology - Large Area Imprint A Solution for Patterning of Micro and Nano Features

The most critical process specifications typically coming from the microlens market are the accuracy and the uniformity of the thickness of the polymer constituting the optical device, directly affecting the optical proprieties of the end product. It is then clear that the extremely high degree of control that the SMILE technology allows in the imprinting process presents a strong advantage for customers in this field. In the present article, the current status of the SMILE technology will therefore be reviewed, with particular focus on its flexibility in performing different types of processes.

SUSS MicroTec Coater

Wafer Scheduling Algorithms - High Throughput, High Flexibiliy or Both?

Every multi module production cluster in the semiconductor industry, like a typical coat and develop tool, can be seen as a classic production plant on the small scale. Sophisticated scheduling algorithms are needed to ensure the optimum use of all available modules in the system, but also frame conditions like maximum dwell times in hot plates or process loops have to be taken into account. Two basic principles with their dedicated advantages and disadvantages are typically used on the market: Fixed sequential handling and Dynamic handling. Each production coating system shipped by SUSS MicroTec is equipped with two different modes of scheduling based on these principles. This article will cover details of both modes, hightlighting the particular advantages and limitations. In addition we will introduce and discuss a new scheduling alogrithm and compare it with the currently available modes


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