Wir bieten Ihnen Gebrauchtmaschinen aus dem kompletten SÜSS MicroTec-Produktportfolio an. Dazu zählen unsere aktuellen Anlagen, aber insbesondere auch Maschinen, die seit vielen Jahren bei Kunden zuverlässig in Gebrauch waren und von uns überholt und zertifiziert wurden. Eine Auswahl dieser Maschinen finden Sie unten auf dieser Seite.
Für Abteilungen und Institute in Forschung und Entwicklung gibt es darüber hinaus günstige Einstiegsvarianten für manuelles Equipment.
Wir freuen uns auf Ihre Anfrage!
Manual Mask Aligner
Manual mask aligner for soft contact, hard contact and vacuum contact exposure modes. Submicron resolutions down to 0.5μm possible. The perfect low cost of ownership tool for research, lab, opto-electronics, small series and pilot production applications.
MJB 3 / UV400 - UV 200
Manual mask aligner for soft contact, hard contact and vacuum contact exposure modes. Submicron resolutions down to 0.5µm possible. The perfect low cost of ownership tool for research, lab, opto-electronics, small series and pilot production applications. Exposure ranges from 450nm down to 193nm.
The MJB4 is the next generation version of the MJB3 which has set industry standards. Touch panel based user interface. Submicron resolutions down to 0.5µm possible. For wafers and substrates up to 100mm. Exposure ranges from 450nm down to 240nm.
The SUSS MA1006 is a manual mask aligner for top and bottom side alignment. All exposure programs such as: proximity, soft, hard and vacuum contact. Programmable control unit and motorized z-axis. Wedge error compensation with calotte chuck.
High performance mask aligner for silicon and compound semiconductors. For research, labs, limited and pilot production.
The SUSS MA6 Mask Aligner is regarded as the benchmark in semiconductor submicron research and 3D micro-system production.
The SUSS MA8 is the system solution for lithography in R&D on formats up to 200 mm. Top and optional bottom side / infrared alignment. Submicron printing down to 0.5mm (UV250). Enhanced Image Storage System (EISS).
The MA/BA8 Gen3 supports emerging processes like micro- and nano-imprinting, bond alignment and UV-bonding as well as selective Plasma activation with its unmatched variety of options and maximum flexibility.
150 mm mask aligner with manual loading function for wafer, substrates and pieces. For laboratory, R&D, small production series, pilot production, optoelectronic and micromechanics. PC-controlled and touch screen interface. All exposure types as: proximity, soft contact, hard contact and vacuum contact are possible.
FE6 Flood Exposure
The FE6 is a manual fullfield exposure tool for areas up to 150mm x 150mm. Capable of exposing the whole wafer in a single shot.
|Manual Mask Aligner MA/BA8||Manual Mask Aligner MA4/6||Manual Mask Aligner MJB3|
Production Mask Aligner
150mm production mask aligner cassette-to-cassette for fully and semi-automatic exposure of wafers or substrates. PC-controlled and touch screen interface. Storage of up to 100 recipes. All exposure types as: proximity, soft contact, hard contact and vacuum contact.
200mm production mask aligner, cassette-to-cassette for fully and semi-automatic exposure of wafers or substrates. PC-controlled and touch screen interface. Storage of up to 100 recipes. Optional: AL3000 Automatic Alignment.
150mm production mask aligner cassette-to cassette with high throughput of up to 170 wafers / hour in first mask mode. Bottom side alignment (BSA) and AL3000 Automatic Alignment System optional available. All exposure modes: proximity, soft, hard and vacuum contact.
200mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers / hour in first mask mode. Bottom side alignment (BSA) and AL3000 Automatic Alignment System optional available. All exposure modes: proximity, soft, hard and vacuum contact.
Automated 4“ mask aligner for high volume production. High throughput of 145wph incl. auto alignment and exposure, up to 215wph at 1st mask mode. AL8000 Auto Alignment with Cognex™ 8100. Linear transport system for fast wafer transfer. Top- and bottom side alignment (TSA & BSA). Cassette-to-Cassette system.
Automated 150mm full field mask aligner for high volume production. High throughput of 170 wph at 1st mask mode. Improved AL8100 Auto Alignment System. Windows graphical user interface according to SEMI Standards. Top- and bottom side alignment (TSA & BSA).
200mm fully automatic cassette-to-cassette production aligner. Linear wafer transport system with high throughput of up to 100 wph including auto alignment. High exposure intensity of up to 125mW/cm² with 5kW light source. Cassette-to-Cassette system.
The SUSS MA200Compact represents the high volume production and state-of-the-art mask aligner. Accurate overlay with DirectAlign®, ThermAlign® and PatMax® advanced pattern recognition system down to ±0.5 μm (3 σ). HR, LGO and new MO Exposure Optics®. Standard mechanical interface (SMIF) I/O option. Robotic handling for cycle handling.
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. ThermAlign® chuck for run-out compensation. Up to 4 load ports for FOUP or open cassette. Mask stocker for up to 10 masks. SECS II/GEM standards compliant.
|Production Mask Aligner MA200Compact||Production Mask Aligner MA200Compact||Production Mask Aligner|
Spin & Spray Coater
Lab Coater LabSpin6 / LabSpin8
The SUSS LabSpin platform represents the next generation of manual coater / developer systems specifically engineered for laboratory and R&D use. For 150mm (LabSpin6) or 200mm (LabSpin8) substrates, both are available as bench mount (BM) or table- top (TT) version.
Manual Spin Coater Delta80 GYRSET®
The Delta 80RC with GYRSET® technology is the ideal tool for planar, as well as coatings over topographies, in the range of up to 20 μm. The GYRSET® quick exchange system, allows for easy change over between wafer sizes.
Manual Spray Coater Delta AltaSpray
The Delta AltaSpray® line of semiautomatic process equipment serves the laboratory and pilot production needs. Enabling technology for patterning across severe topography from some microns up to 600 μm and more. Equipped with a reliable top edge coverage while avoiding resist accumulation in trenches.
Manual Spin Coater Delta12RC GYRSET®
The Delta12 RC spin coater combined with the SUSS GYRSET® rotating closed cover meets all expectations of a modern spin coater. The tool accepts wafer sizes up to Ø 300 mm or substrates up to 9" x 9". It is available as a coater and/or developer stand-alone and as bench mounted module.
Manual Spin Coater RC8
The RC8 provides advanced spin coating with the SUSS patented GYRSET ® cover system. With less then 5 minutes changeover time for wafer / substrate size change. Offering Windows based operation with fully programmable process parameters.
Manual Spin Coater RC13 (RC16 / RC22 / RC33)
The RC13 to RC33 series are large area spin coaters for extra large substrates. With SUSS patented closed cover GYRSET® system for improved uniformity and process control.
Production Coater Falcon
The SUSS Falcon coater is a state of the art technology and performance tool, designed to the needs of 250, 180, 150, and 130 nanometer technology nodes volume production. Providing full cleanroom environment with module airflow and climate control. The flexible architecture of the SUSS Falcon allows the configuration of simple, or highly complex systems.
Production Coater Gamma (60/80)
SUSS Gamma systems are fully automatic and compact cluster tools with central robot and radially distributed process modules. For Clean, and reliable coating processes with photo-resist, BCB or polyimide. Equipped with parallel spin modules and/or AltaSpray modules for topography coating.
Production Coater ACS200Plus
The SUSS ACS200Plus is a modular coat / develop cluster system that enables excellent coating and developing uniformity on round, square and rectangular substrates. The preferred tool for sophisticated photoresist processing for high volume MEMS, 3D-integration, optoelectronics and packaging applications.
|Production Coater Gamma||Manual Spray Coater Delta AltaSpray||Manual Spin Coater Delta80RC|
Scriber & Metrology Systems
Manual Scriber MS100
The MS100 is a manual scribing tool for R&D, laboratory, small series and pilot production applications.
Low investment and low cost of ownership. Versatile treatment of all kind of wafers and substrates from small pieces up to 100mm. High flexibility with various options and accessories.
Metrology System DSM8
The DSM8 is a front to backside overlay measuring tool for double sided processed wafers and substrates. Reliability, precision and speed make the SUSS DSM8 the tool of choice for both the R&D and production environment. Easy understandable, straight forward operation, no special training required.
Metrology System DSM200
The DSM200 is a fully automatic robotic handling and top to bottom side overlay measurement tool. It is the ideal tool for verifying alignment accuracy on wafers or substrates from 2” to 200 mm at highest measurement precision of 0.2μm at 3s. Automatic operation with self-calibration to ensure results independent of operator.
|Manual Scriber MS100|
Upgrades and Other Products
Upgrade Mask Aligner MA150/200CC to e-Versions
Enhance the capabilities of your MA150/200CC Mask Aligner: Upgrade to state-of-the-art, Windows based GUI operated by touch screen. Get a new level of process stability with the latest pattern recognition PatMax software. Achieve submicron alignment precision with DirectAlign.
Other Products, Accessories and Services
- Retrofit of your system to changed application needs such as Wafer / Substrate size and materials, Exposure optics, Backside alignment and the like
- Various types of microscopes and accessories
- Spare parts support for all listed systems
- Damage and Value Assessments
|Mask Aligner MA150/200CC to e-Versions|