The corporate headquarters of SÜSS MicroTec AG is located in Garching near Munich, Germany. The group encompasses production sites as well as sales offices in Asia, Europe and North America.

Lithography solutions and wafer bonders represent the group’s core business. Highly accurate photolithography tools are produced by the Lithography Division with a main focus on mask aligners and spin as well spray coaters. The Bonder Division is specialized in the development of production wafer bonders for high-volume packaging markets while also providing manual systems.

The Photomask Equipment Division offers a superior suite of equipment solutions for photomask and imprint mask processing. It is complemented by specialized solutions such as nanoimprint lithography tools and optical lenses.