3-D Architectures for Semiconductor Integration and Packaging Conference
| Date: | December 12-14, 2012 |
| Location: | Sofitel San Francisco Bay, Redwood City CA |
| Website: | techventure.rti.org |
Paper Presentation
| Date: | December 14, 2012 |
| Title: | Temporary Bonding and "PowerPoint Engineering" |
| Presenter: | Wilfried Bair General Manager SUSS MicroTec |
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