November 15, 2012

SUSS Asia Technology Forum - Singapore

SUSS MicroTec would like to invite you to the Asia Technology Forum covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging.

The SUSS Asia Technology Forum will be held in Singapore and will feature speakers from industry leading companies and world-renowned research institutions.
Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.

SUSS MicroTec and partners look forward to welcoming you!

Details

Date:	November 15, 2012
Time:	09:00 - 16:45
Location:	York Hotel, 21 Mount Elizabeth Singapore, 228516
Website:	http://www.yorkhotel.com.sg

Agenda

Agenda
Moderator: Mr. Pascal Viaud, CTO Yole Development Taiwan
09:00	Registration / Coffee & Drinks
09:45	Welcome	G. Choquette (General manager SUSS Singapore)
10:00	Slot1	Advanced 3D TSV Technology Yoon Seung Wook, Ph.D (Deputy Director, Products & Technology Marketing ) STATS ChipPAC
10:30	Slot2	3D Integration Development Status at ITRI Chun-Hsien Chien (Project Manager) Industrial Technology Research Institute
11:00	Break
11:15	Slot3	3D TSV Market Trends Pascal Viaud (CTO Yole Taiwan) Yole Development
11:45	Slot4	Conformal Coating of Dielectric Layers and Negative Resists by Spray Deposition Dr. Dietrich Toennies (Director Process Technology) SUSS MicroTec Lithography GmbH
12:15	Lunch
13:15	Slot5	Temporary Bonding and Debonding - An overview of today’s materials and methods Chris Rosenthal (Product Manager Bonder) SUSS MicroTec
13:45	Slot6	3DIC / Temporary Bonding Material Requirements Alvin Lee (Business Application Manager) Brewer Science
14:15	Slot7	Temporary Wafer Bonding Technology for High Temperature Compliant Thin Wafer Processing Kai Zoschke (Group Manager – 3D Integration / Waferbonding) Fraunhofer IZM Berlin
14:45	Break
15:15	Slot8	Highly Thermal Resistant Polyimide Adhesives for Thinned Wafer Handling in 3D-Packaging Technology Masashi Kotani, Ph.D (Senior Researcher, Technology Development Center) HD MicroSystems
15:45	Slot9	Novel Patterning Solutions for Significant Cost Reduction in WLP Processes Ralph Zoberbier (Director Product Management Exposure and Laser Processing) SUSS MicroTec Lithography GmbH
16:15	Slot10	Simulation for Advanced Mask Aligner Lithography supporting the new SUSS MO Exposure Optics Nezih Ünal (Vice President Marketing) GenISys
16:45	End of workshop

The agenda is subject to change.