November 15, 2012

SUSS Asia Technology Forum - Singapore

SUSS MicroTec would like to invite you to the Asia Technology Forum covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging.

The SUSS Asia Technology Forum will be held in Singapore and will feature speakers from industry leading companies and world-renowned research institutions.
Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.

SUSS MicroTec and partners look forward to welcoming you!

Details

Date:November 15, 2012
Time:09:00 - 16:45
Location: York Hotel, 21 Mount Elizabeth Singapore, 228516
Website:http://www.yorkhotel.com.sg

Agenda

Agenda
Moderator: Mr. Pascal Viaud, CTO Yole Development Taiwan
09:00 Registration / Coffee & Drinks
09:45 Welcome G. Choquette (General manager SUSS Singapore)
10:00 Slot1 Advanced 3D TSV Technology
Yoon Seung Wook, Ph.D (Deputy Director, Products & Technology Marketing )
STATS ChipPAC
10:30 Slot2 3D Integration Development Status at ITRI
Chun-Hsien Chien (Project Manager)
Industrial Technology Research Institute
11:00 Break
11:15 Slot3 3D TSV Market Trends
Pascal Viaud (CTO Yole Taiwan)
Yole Development
11:45 Slot4 Conformal Coating of Dielectric Layers and Negative Resists by Spray Deposition Dr. Dietrich Toennies (Director Process Technology)
SUSS MicroTec Lithography GmbH
12:15 Lunch
13:15 Slot5 Temporary Bonding and Debonding - An overview of today’s materials and methods
Chris Rosenthal (Product Manager Bonder)
SUSS MicroTec
13:45 Slot6 3DIC / Temporary Bonding Material Requirements
Alvin Lee (Business Application Manager)
Brewer Science
14:15 Slot7 Temporary Wafer Bonding Technology for High Temperature Compliant Thin Wafer Processing
Kai Zoschke (Group Manager – 3D Integration / Waferbonding)
Fraunhofer IZM Berlin
14:45 Break
15:15 Slot8 Highly Thermal Resistant Polyimide Adhesives for Thinned Wafer Handling in 3D-Packaging Technology
Masashi Kotani, Ph.D (Senior Researcher, Technology Development Center)
HD MicroSystems
15:45 Slot9 Novel Patterning Solutions for Significant Cost Reduction in WLP Processes
Ralph Zoberbier (Director Product Management Exposure and Laser Processing)
SUSS MicroTec Lithography GmbH
16:15 Slot10 Simulation for Advanced Mask Aligner Lithography supporting the new SUSS MO Exposure Optics
Nezih Ünal (Vice President Marketing)
GenISys
16:45 End of workshop

The agenda is subject to change.