SUSS Japan Seminar 2012

SUSS MicroTec Japan is holding two seminars on December 4th 2012.

Session I : Mask Integrity Challenges – Path to NGL Production

A seminar covering Next Generation Lithography process, 193i 2x/3x, EUVL and Nano-Imprint, the need for defect-free masks and significant challenges facing in next generation lithography reticles and new solutions that guarantee the highest level of mask integrity.

Session II:  3D Integration Technologies – Trends and Challenges

A seminar covering latest market trend & roadmap on 3D Integration Technologies where TSV, RDL, thin wafer handling, CMP, hybrid bonding, interposers, temporary bonding, plating, chip stacking topics will be explored. In addition, SUSS will introduce our latest product roadmap in Projection Lithography and Laser Technologies in patterning conductive and non-conductive organic materials.

More information

Registration	Agenda Session I	Agenda Session II