3D Architectures for Semiconductor Integration and Packaging: Dec. 11-13

3D ASIP

Visit us at the 3D ASIP conference and discuss developments and future directions on 3D technology. Meet our experts and address questions about materials, equipment and processing of your application.

Details

Date:December 11-13, 2013
Location: Burlingame (CA), USA
Address:Hyatt Regency San Francisco Airport, 1333 Bayshore Highway, Burlingame, California, USA, 94010
Website:www.3dasip.org

Activities

Presentations

SESSION 6

Topic:Thermal Technologies and Design Considerations for 3D ICS
Presenter:Wilfried Bair, General Manager
SUSS MicroTec
Date:December 12, 2013

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