3D Architectures for Semiconductor Integration and Packaging: Dec. 11-13
Visit us at the 3D ASIP conference and discuss developments and future directions on 3D technology. Meet our experts and address questions about materials, equipment and processing of your application.
|Date:||December 11-13, 2013|
|Location:||Burlingame (CA), USA|
|Address:||Hyatt Regency San Francisco Airport, 1333 Bayshore Highway, Burlingame, California, USA, 94010|
|Topic:||Thermal Technologies and Design Considerations for 3D ICS|
|Presenter:||Wilfried Bair, General Manager|
|Date:||December 12, 2013|