Visit us at the 10th Annual International Wafer-Level Packaging Conference and discuss developments and future directions on all aspects of wafer-level, 3D, TSV, and MEMS device packaging. Meet our experts and address questions about materials, equipment and processing of your application.


Name:IWLPC - International Wafer-Level Packaging Conference
Date: November 5-7, 2013
Location: San Jose, CA - USA
Address: DoubleTree by Hilton Hotel, 2050 Gateway Place, San Jose, CA 95110
Booth #:30


Presentation - MEMS Track

Topic:Advanced Metal-Eutectic Bonding for High Volume MEMS WLP
Presenter:Sumant Sood, SUSS MicroTec
Date:November 6, 2013
Session #:6 - Wafer Bonding and Testing for MEMS


Presentation - WLP Track

Topic:Choosing Lithography Equipment to Minimize the Cost of Wafer Level Packaging
Presenter:Tim McCrone, SUSS MicroTec 
Date:November 7, 2013
Session #:10 - Fan-Out Wafer-Level Packaging Technologies

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