SEMICON Taiwan 2013: September 4-6

SEMICON Taiwan 2013

Our experts will be available to present our latest equipment and process solutions for the 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor market.

Details

Date:September 4-6, 2013
Location: TWTC Nangang Exhibition Hall, Taipei, Taiwan
Booth #:478
Website:www.semicontaiwan.org

 

We will present interesting insights about 3D IC and wafer level packaging at the Advanced Packaging Forum and the 3D IC Technology Forum

Advanced Packaging Forum

Topic:Excimer Laser Ablation – A Novel Pattering Technology for Wafer Level Packages 
Presenter:Ralph Zoberbier
Date:4 September 2013
Time:08:30 - 16:50
Location:504A, 5F, TWTC Nangang Exhibition Hall, Taipei
Agenda:Click here


3D IC Forum

Topic:Update in Material and Process Technologies for 2.5/3D IC
Presenter:Dr. Rainer Knippelmeyer
Date:5 September 2013
Time:08:30 - 17:00
Location:504A, 5F, TWTC Nangang Exhibition Hall, Taipei
Agenda:Click here