Our experts will be available to present our latest equipment and process solutions for the 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor market.


Date:July 9-11, 2013
Location: Moscone Center, San Francisco, California
Booth #:South Hall, 1707

SUSS Technology Forum

SUSS Technology Forum

Industry experts in materials, equipment and processing will be joining SUSS MicroTec in addressing the status of the 3D TSV infrastructure and recent advances in 3D processing technologies.

Date:July 9, 2013 (07/09/2013)
Time:9:15 a.m. – 5:30 p.m.
followed by reception
Location: The St. Regis San Francisco, 125 3rd St, San Francisco

Registration closed.