SUSS MicroTec would like to invite you to the SUSS Technology Forum JAPAN covering the latest in 3D technology & market trends, patterning technology in Advanced 3D Packaging and temporary & permanent bonding in thin wafer handling technology. The SUSS Technology Forum JAPAN will be held in Tokyo, Japan and will feature speakers from industry leading companies and world-renowned research institutions.

Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.

SUSS MicroTec and partners look forward to welcoming you!

Date:Dec. 3rd (Tue) , 2013
Place:Hyatt Regency Tokyo 28F,2-7-2 Nishi-Shinjuku, Shinjuku-Ku Tokyo
Registration:12 pm 
Seminar:1 pm - 6 pm


Moderator: Yuta Nagai (SUSS MicroTec KK)
Session I: 3D Technology & Market Trend
13:00 Welcome Remarks
Frank Averdung, CEO
SÜSS MicroTec AG
13:20 Keynote: A New Embedded Package Structure and Technology for Next Generation of WLP
Akio Katsumata, General Manager, Packaging Research & Development Center
13:50 3DIC and 3D Packaging Market Update
Rozalia Beica, CTO
Yole Développement
14:15 On the Road to 3D Wafer Level System Integration
Jürgen Wolf, Head of Division Wafer Level System Integration
14:40Coffe Break
Session II: Patterning Technology in Advanced 3D Packaging
14:55 Reliability Enhancement of Cu Pillar Bump - Utilize New AZ/IPS-528(fx) Thicker Film Resist
Erik So, Marketing Director Packaging Materials
AZ Electronics Materials
15:15 Excimer Laser Ablation - A Novel Patterning Technology for Wafer Level Packages
Ralph Zoberbier, Director Product Management Exposure and Laser Processing
SUSS MicroTec
15:40 High Power Excimer Laser for Advanced Manufacturing
Tomohiro Morimoto, Major Account Manager, Strategic Customer Sales Group
Coherent Japan, Inc.
16:00 A New Concept of Dielectric Layer Using Excimer Laser Ablation Process for Fan Out Package
Atsushi Takahashi, Advanced Technology Development Project Manager
Nagase & Co., Ltd.
16:20 Coffee Break
Session III: Temporary & Permanent Bonding in Thin Wafer Handling Technology
16:35 Temporary Bonding and Debonding - An Overview of Today’s Materials and Processes
Stefan Lutter (General Manager Bonder Division)
SUSS MicroTec
17:00 Laser Patternable Resists, Dielectric Materials, and Temporary Wafer Bonding Materials for 3D-TSV Integration
Masaki Kondo
Rohm and Haas Electronic Materials K.K.
17:30 Permanent Bonding Technology
Hiroyuki Ishida (Business Development Manager)
SUSS MicroTec Japan KK
17:50 Closing Remarks
Raymond Lau (Representative Director)
SUSS MicroTec Japan KK
18:00 Reception
19:30 End

The agenda is subject to change without notice.