SUSS Japan Seminar 2013
SUSS Technology Forum JAPAN
SUSS MicroTec would like to invite you to the SUSS Technology Forum JAPAN covering the latest in 3D technology & market trends, patterning technology in Advanced 3D Packaging and temporary & permanent bonding in thin wafer handling technology. The SUSS Technology Forum JAPAN will be held in Tokyo, Japan and will feature speakers from industry leading companies and world-renowned research institutions.
Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.
SUSS MicroTec and partners look forward to welcoming you!
|Date:||Dec. 3rd (Tue) , 2013|
|Place:||Hyatt Regency Tokyo 28F,2-7-2 Nishi-Shinjuku, Shinjuku-Ku Tokyo|
|Seminar:||1 pm - 6 pm|
|Moderator: Yuta Nagai (SUSS MicroTec KK)|
|Session I: 3D Technology & Market Trend|
|13:00||Welcome Remarks |
Frank Averdung, CEO
SÜSS MicroTec AG
|13:20||Keynote: A New Embedded Package Structure and Technology for Next Generation of WLP |
Akio Katsumata, General Manager, Packaging Research & Development Center
|13:50||3DIC and 3D Packaging Market Update |
Rozalia Beica, CTO
|14:15||On the Road to 3D Wafer Level System Integration |
Jürgen Wolf, Head of Division Wafer Level System Integration
|Session II: Patterning Technology in Advanced 3D Packaging|
|14:55||Reliability Enhancement of Cu Pillar Bump - Utilize New AZ/IPS-528(fx) Thicker Film Resist |
Erik So, Marketing Director Packaging Materials
AZ Electronics Materials
|15:15||Excimer Laser Ablation - A Novel Patterning Technology for Wafer Level Packages |
Ralph Zoberbier, Director Product Management Exposure and Laser Processing
|15:40||High Power Excimer Laser for Advanced Manufacturing |
Tomohiro Morimoto, Major Account Manager, Strategic Customer Sales Group
Coherent Japan, Inc.
|16:00||A New Concept of Dielectric Layer Using Excimer Laser Ablation Process for Fan Out Package |
Atsushi Takahashi, Advanced Technology Development Project Manager
Nagase & Co., Ltd.
|Session III: Temporary & Permanent Bonding in Thin Wafer Handling Technology|
|16:35||Temporary Bonding and Debonding - An Overview of Today’s Materials and Processes|
Stefan Lutter (General Manager Bonder Division)
|17:00||Laser Patternable Resists, Dielectric Materials, and Temporary Wafer Bonding Materials for 3D-TSV Integration |
Rohm and Haas Electronic Materials K.K.
|17:30||Permanent Bonding Technology |
Hiroyuki Ishida （Business Development Manager）
SUSS MicroTec Japan KK
|17:50||Closing Remarks |
Raymond Lau （Representative Director）
SUSS MicroTec Japan KK
The agenda is subject to change without notice.