SUSS Technology Forum ASIA 2013 - China

SUSS MicroTec would like to invite you to the SUSS Technology Forum ASIA covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging.The SUSS Asia Technology Forum will be held on three separate dates at three convenient locations - Taiwan, China and Korea - and will feature speakers from industry leading companies and world-renowned research institutions.

Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.

SUSS MicroTec and partners look forward to welcoming you!


Shanghai, China •  November 15, 2013
SIMIT • Shanghai Institute of Microsystem and Information Technology
865 Changning Road • Shanghai 200050


Moderator: Jean-Christophe Eloy, President and CEO of Yole Développement
09:00 Registration
09:30 Welcome Dr. Li Gong, General Manager
SUSS MicroTec (Shanghai)
09:40 Slot 1 TSV 3D Integration, Technology, Challenge and Opportunity in China
Prof. Jin Yufeng, Director of IME Peking University
Peking University
10:00 Slot 2 3DIC and 3D Packaging Market Update
Jean-Christophe Eloy, President and CEO

Yole Développement
10:20 Slot 3 Technology and Status of 3D Wafer Level System Integration at Fraunhofer, IZM
Kai Zoschke, Group Manager – 3D Integration / Waferbonding
10:40 Break
11:00 Slot 4 High Resolution Patterning of Taiko Wafers by Proximity Printing
Dr. Dietrich Toennies, Director Process Technology
SUSS MicroTec
11:20 Slot 5 Reliability Enhancement of Cu Pillar Bump – Utilize New AZ/IPS-528(fx Thicker Film Resist
Erik So, Marketing Director Packaging Materials
AZ Electronic Materials
11:40 Slot 6 Advances and Application of Mask Aligner Lithography Simulation for 3D Packaging
Nit Taksatorn, Application Support Engineer
12:00 Lunch
13:20 Slot 7 Improved Reliability of WLCSP Devices with New Final Passivation Material
Susan Chen, Manager - Asia Pacific Business Development
13:40 Slot 8 Update on Novel Patterning Solutions for ADP Applications
Matthew Gingerella, International Product Specialist
SUSS MicroTec
14:00 Slot 9 High Power Excimer Laser for Advanced Manufacturing
Ludolf Herbst, Product Line Manager
Coherent Laser Systems
14:20 Break
14:40 Slot 10 Photo- and Laser- Patternable Plating Resists and Dielectric Materials for 3D-TSV
Dr. Jong-Uk Kim, Senior Chemist and Applications Manager
Dow Chemical
15:00 Slot 11 Temporary Bonding and Debonding - an Overview of Today’s Materials and Processes
Stefan Lutter, General Manager Bonder Division
SUSS MicroTec
15:20 Slot 12 Thin Wafer Handling Materials Update
Alvin Lee, Deputy Director Advanced Packaging
Brewer Science
15:40 Break
16:00 Slot 13Thermally Stable Temporary Wafer Bonding Material for 3D-TSV Integration
Dr. Jong-Uk Kim, Senior Chemist and Applications Manager
Dow Chemical
16:20 Slot 14TSV Technology without Dry Process
Dr. Frédéric Raynal, CTO
16:40 Slot 15High Precision Flip-chip Bonder for C2W and C2C Application
Dr. Li Gong, General Manager
17:00 End of Workshop

The agenda is subject to change without notice.