SUSS Technology Forum ASIA - Korea

SUSS MicroTec would like to invite you to the SUSS Technology Forum ASIA 2013 covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging.The SUSS Asia Technology Forum will be held on three separate dates at three convenient locations - Taiwan, China and Korea - and will feature speakers from industry leading companies and world-renowned research institutions.

Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.

SUSS MicroTec and partners look forward to welcoming you!


Seoul, Korea • November 19, 2013
Novotel Ambassador Gangnam
603 Yeoksam-Dong, Gangnam-Gu • Seoul


Moderator: Jean-Christophe Eloy, President and CEO of Yole Développement
09:00 Registration
09:30 Welcome Heinz Siegert, General Manager
SUSS MicroTec (Korea)
09:40 Slot 1 3D Packaging Technology
Dr. Jin Young Khim, Sr. Director / Research Team Manager
Amkor Technology
10:00 Slot 2 3DIC and 3D Packaging Market Update
Jean-Christophe Eloy, President and CEO
Yole Développement
10:20 Slot 3 Technology and Status of 3D Wafer Level System Integration at Fraunhofer, IZM
Kai Zoschke, Group Manager – 3D Integration / Waferbonding
Fraunhofer IZM
10:40 Break
11:00 Slot 4 Improved Reliability of WLCSP Devices with New Final Passivation Material
Susan Chen, Manager - Asia Pacific Business Development
11:20 Slot 5 High Resolution Patterning of Taiko Wafers by Proximity Printing
Dr. Dietrich Toennies, Director Process Technology
SUSS MicroTec
11:40 Slot 6 Advances and Application of Mask Aligner Lithography Simulation for 3D Packaging
Ulrich Hofmann, General Manager
12:00 Lunch
13:20 Slot 7 Reliability Enhancement of Cu Pillar Bump – Utilize New AZ/IPS-528(fx Thicker Film Resist
Erik So, Marketing Director Packaging Materials
AZ Electronic Materials
13:40 Slot 8 Update on Novel Patterning Solutions for ADP Applications
Matt Souter, Dir. Global Laser Sales & Laser Product Manager
SUSS MicroTec
14:00 Slot 9 High Power Excimer Laser for Advanced Manufacturing
Rainer Pätzel, Director of Marketing
Coherent Laser Systems
14:20 Break
14:40 Slot 10 Photo- and Laser- Patternable Plating Resists and Dielectric Materials for 3D-TSV
Dr. Jong-Uk Kim , Senior Chemist and Applications Manager
Dow Chemical
15:00 Slot 11 TSV Process and Business Opportunities with Cost Simulation
Prof. Gusung Kim, Senior Researcher, Technology Development Center
Kangnam University
15:20 Slot 12 Temporary Bonding and Debonding - an Overview of Today’s Materials and Processes
Stefan Lutter, General Manager Bonder Division
SUSS MicroTec
15:40 Break
16:00 Slot 13Thermally Stable Temporary Wafer Bonding Material for 3D-TSV Integration
Dr. Jong-Uk Kim , Senior Chemist and Applications Manager
Dow Chemical
16:20 Slot 14Thin Wafer Handling Materials Update
Alvin Lee, Deputy Director Advanced Packaging
Brewer Science
16:00 End of workshop

The agenda is subject to change without notice.