SUSS Asia Technology Forum

SUSS Technology Forum ASIA 2013 - Taiwan

SUSS MicroTec would like to invite you to the SUSS Technology Forum ASIA 2013 covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging. The SUSS Asia Technology Forum will be held on three separate dates at three convenient locations - Taiwan, China and Korea - and will feature speakers from industry leading companies and world-renowned research institutions.

Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.

SUSS MicroTec and partners look forward to welcoming you!

Details

Hsinchu, Taiwan • November 13, 2013
ITRI • Industrial Technology Reserach Institute
195, Sec. 4, Chung Hsing Rd. • Chutung, Hsinchu • Taiwan 31040, R.O.C.

Agenda

Agenda
Moderator: Jean-Christophe Eloy, President and CEO of Yole Développement
09:00 Registration
09:30 Welcome Heinz Siegert, General Manager
SUSS MicroTec (Taiwan)
09:40 Slot 1 ITRI’s 3D Integration and Ad-STAC Update
Dr. Wei-Chung Lo, Director of Packaging Technology Division
ITRI
10:00 Slot 2 3DIC and 3D Packaging Market Update
Jean-Christophe Eloy, President and CEO
Yole
Développement
10:20 Slot 3 Advanced FC Package and 3DIC
Max Lu, Deputy Director of Customer Advanced Package Development
SPIL
10:40 Break
11:00 Slot 4 Photo- and Laser- Patternable Plating Resists and Dielectric Materials for 3D-TSV
Dr. Jong-Uk Kim, Senior Chemist and Applications Manager
Dow Chemical
11:20 Slot 5 Update on Novel Patterning Solutions for ADP Applications
Matthew Gingerella, International Product Specialist
SUSS MicroTec
11:40 Slot 6 High Power Excimer Laser for Advanced Manufacturing
Ludolf Herbst, Product Line Manager
Coherent Laser Systems
12:00 Lunch
13:20 Slot 7 Reliability Enhancement of Cu Pillar Bump – Utilize New AZ/IPS-528(fx Thicker Film Resist
Erik So, Marketing Director Packaging Materials
AZ Electronic Materials
13:40 Slot 8 Advances and Application of Mask Aligner Lithography Simulation for 3D Packaging
Nezih Unal, Vice President Marketing
GeniSys
14:00 Slot 9 High Resolution Patterning of Taiko Wafers by Proximity Printing
Dr. Dietrich Toennies, Director Process Technology
SUSS MicroTec
14:20 Break
14:40 Slot 10 Improved Reliability of WLCSP Devices with New Final Passivation Material
Susan Chen, Manager - Asia Pacific Business Development
LORD
15:00 Slot 11 Technology and Status of 3D Wafer Level System Integration at Fraunhofer, IZM
Kai Zoschke, Group Manager – 3D Integration / Waferbonding
Fraunhofer IZM
15:20 Slot 12 Temporary Bonding and Debonding - an Overview of Today’s Materials and Processes
Stefan Lutter, General Manager Bonder Division
SUSS MicroTec
15:40 Break
16:00 Slot 13Status of TSV Manufacturing
John H. Lau, Fellow
ITRI
16:20 Slot 14Thermally Stable Temporary Wafer Bonding Material for 3D-TSV Integration
Dr. Jong-Uk Kim, Senior Chemist and Applications Manager
Dow Chemical
16:40 Slot 15Thin Wafer Handling Materials Update
Alvin Lee, Deputy Director Advanced Packaging
Brewer Science
17:00 End of workshop

The agenda is subject to change without notice.