The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global companies.
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.
|Date:||January 20-22, 2014|
|Address:||MINATEC, 3 parvis Louis Néel, 38054 F-Grenoble cedex 9|
|Topic:||Innovative Temporary Bonding and Debonding Technologies|
|Presenter:||Stefan Lutter, General Manager Bonder Division|
|Date:||January 21, 2014|