SEMI Europ. 3D TSV Summit: Jan. 20-22

SEMI European 3D TSV Summit

The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global companies.
   
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.

Details

Date:January 20-22, 2014
Location: Grenoble, France
Address:MINATEC, 3 parvis Louis Néel, 38054 F-Grenoble cedex 9
Website:www.semi.org/eu/node/8566

Activities

Presentations

SESSION 5

Topic:Innovative Temporary Bonding and Debonding Technologies
Presenter:Stefan Lutter, General Manager Bonder Division
SUSS MicroTec
Date:January 21, 2014
Time:9:40-10:05

More Information