Glass Frit wafer bonding has been the traditional wafer bonding technique used in MEMS production worldwide. Glass frit applications include three axis accelerometers, gyroscopes and pressure sensors used in automotive, gaming and cellular phone technology. SUSS MicroTec’s ABC200 is a standard production platform for glass frit wafer bonding. ABC200 Production Bond Clusters are operating in 24/7 production environments worldwide within the MEMS industry.

Main Markets

• MEMSGyroscopes, Accelerometers RF, Pressure Sensors

• Temporary Wafer Bonding/Debonding
• Fusion Wafer Bonding
• Metal Diffusion Bonding
• Metal Eutectic Bonding
• Polymer Adhesive Bonding
• Glass Frit Wafer Bonding
• Anodic Wafer Bonding