Metal Diffusion Bonding

Metal diffusion bonds include Cu-Cu, Al-Al, Au-Au and others metallurgies that enable better hermeticity than traditional glass frit and anodic bonds. In addition, the use of metal diffusion bonds in 3D applications allows the mechanical and electrical connections to be made between two wafers in one step. Metal diffusion also enables superior post bond alignment accuracy over glass frit bonding. Aluminum metallization is used frequently in MEMS device structures and offers the potential to serve as a sealing metallurgy during device packaging steps via a diffusion reaction.

Advances in CMP techniques and deposition methods have made metal diffusion bonding an excellent choice for anodic and glass frit replacement. SUSS MicroTec’s CB series wafer bonders provide a high degree of temperature and force uniformity to meet the requirements for metal bonding.

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