Metal eutectic bonding of wafers is used in advanced MEMS packaging and 3D integration technologies. A unique feature of eutectic metals is the melting of the solder-like alloys that facilitate surface planarization and provides a tolerance of surface topography and particles.

Eutectic bonding requires precise force delivery and controlled uniform temperature to control reflow of the eutectic material. See the SUSS MicroTec CB series bonders for more details.

Main Markets

• 3D IntegrationTSV’s, 3D IC, Memory Stacking and 3D Packaging
• Compound SemiconductorLED Packaging, High Brightness LEDs
• MEMSHermetic Packaging, CMOS Integration, Advanced Packaging

• Temporary Wafer Bonding/Debonding
• Fusion Wafer Bonding
• Metal Diffusion Bonding
• Metal Eutectic Bonding
• Polymer Adhesive Bonding
• Glass Frit Wafer Bonding
• Anodic Wafer Bonding