Polymer and adhesive bonding provide solutions for advanced packaging, 3D Integration, and temporary bonding. Many choices of materials including epoxies, dry films, BCB, polyimides, and UV curable compounds exist. SUSS MicroTec provides a full line of processing equipment for these applications. The bonder products are specifically tailored to meet performance and cost of ownership needs for MEMS, lens stacking and CMOS Image Sensor manufacturing.

Main Markets

• 3D IntegrationBCB, TSV’s, 3D IC, Memory Stacking and 3D Packaging
• Compound SemiconductorLED Packaging, Si-III/V and other compound semiconductor integration
• MEMSAdvanced Packaging

• Temporary Wafer Bonding/Debonding
• Fusion Wafer Bonding
• Metal Diffusion Bonding
• Metal Eutectic Bonding
• Polymer Adhesive Bonding
• Glass Frit Wafer Bonding
• Anodic Wafer Bonding