Temporary Wafer Bonding

SUSS MicroTec’s universal temporary wafer bonding approach allows users to configure the XBC300 for a range of materials and processes. The XBC300 allows users the freedom to process all temporary wafer bond adhesives: Brewer Science HT 10.10, 3M™ Wafer Support System (WSS), HD Micro polyimide and TMAT.

Key process steps for temporary bonding with the XBC300 include coating of adhesives, baking and cooling, UV exposure (3M WSS process), release layer formation (TMAT process), and temporary bonding.

Wafer Debonding

Wafer debonding processes vary widely using thermal release (Brewer Science), laser release and peel (3M WSS) and mechanical release (TMAT) methods. Each of these approaches requires equipment specifically designed and tested for the selected adhesive. SUSS MicroTec offers both semi-automated and fully automated wafer debonders to support the various adhesives.

SUSS MicroTec offers a DB12 semi-automated wafer debonder and a DB300 de-bonder module that can be integrated into an XBC300 configured for debonding. SUSS’ debonding solution allows customers to reclaim their carriers.

SUSS MicroTec is pleased to work with you to select the best adhesive for your needs.

• Temporary Wafer Bonding/Debonding
• Fusion Wafer Bonding
• Metal Diffusion Bonding
• Metal Eutectic Bonding
• Polymer Adhesive Bonding
• Glass Frit Wafer Bonding
• Anodic Wafer Bonding