Ready for the Next Generation Resists

The inherent cost advantage, flexibility, and ease or use of SUSS MicroTec lithography systems make them extremely attractive solutions for a wide range of thin and thick resist applications. SUSS MicroTec lithography systems have been proven especially well suited for production processes with standard photoresists, as well as for applications where either the resist thickness or wafer topography ranges up to several hundred microns. With polymers, such as BCB or photo-sensitive polyimides SUSS MicroTec lithography equipment yields excellent results especially for MEMS , 3D Integration and Wafer Level Packaging.

As a direct response to the resolution limitation of most process materials resist manufacturers have introduced chemically amplified resists SUSS Microtec coaters and mask aligners have demonstrated excellent results even with these some most demanding materials.

Process Details

• Standard Photoresists
• Thick Photoresists
• High Topography

• Mask Aligner
• Spin Coater & Spray Coater