Knowledge Shared - SUSSreport
Our bi-annual customer magazine SUSS report provides you with an insider update on innovations and trends in equipment solutions for the semiconductor and related industries. You will find exciting technical publications as well as praxis-orientated reports and personal notes by our experts.
Have a look in our latest SUSS report issue as well as in our archive.
We are happy to share with you the latest issue of our customer magazine „SUSS report“.
IN THIS ISSUE:
- Editorial – F. Averdung, President and CEO of SUSS MicroTec
- Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling
- Ordered Arrays of Nanoporous Gold Nanoparticles
- Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods
- LED Wafer Level Packaging – Motivation, Challenges and Solutions to Meet Future Cost Targets
- Spray Coating Negative Tone Resists
- SUSS MicroTec Hosted Asia Technology Forum