Press release: SECAP Disbands After Successfully Achieving Goals

SECAP Disbands After Successfully Achieving Goals

Consortium goal achieved: High Volume and Cost effective 300 mm production line fully operable

MUNICH, Germany, June 20th, 2005 - The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) today announced that they will disband now that the consortium has successfully established 300 mm Wafer Level Packaging as a functional technology and full-volume production on the first installed wafer-bumping line is underway. Established in July 2000 by leading equipment suppliers to the advanced packaging industry, SECAP aimed to address challenges in the development and validation of process equipment for the industry's conversion to wafer level packaging and 300 mm wafer technology.  Member companies were Semitool, SUSS MicroTec, Image Technology, Unaxis, EKRA, BTU International and the Fraunhofer Institute for Reliability and Microintegration (IZM) in Berlin. Later Nexx Systems joined the consortium along with many consumables suppliers. Since July 2002, SECAP members worked closely together with Amkor/Unitive to develop a 300mm wafer bumping line which addresses the technical demands of wafer level packaging. The line is equipped for electroplated solder bumping and was set up at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan. After line qualification, which started in May 2003, it was open for a short period of time for interested parties to view and to verify its capabilities . Amkor acquired the line at end of 2004 and it is now in high volume production. With this acquisition SECAP has accomplished its mission to demonstrate to the advanced packaging industry a cost effective equipment solution for 300 mm electroplated solder bumping. For the past 5 years, SECAP has been the main source of information on wafer bumping and wafer level packaging technologies, hosting numerous seminars throughout the world. SECAP members will continue to work closely together on other projects as and when determined.

"The achievements by the members of SECAP have been a notable success in advancing 300mm wafer level packaging into mainstream production" stated Paul Siblerud, Vice President of ElectroChemical Deposition at Semitool. Dr. Dietrich Tnnies, Lithography Business Development Manager of SUSS MicroTec adds, "While the official reason for the collaboration is considered ready for the market and therefore doesn't require further development from a consortium, the member companies still have a very strong relationship and will continue to work together in other forms in the future".

About SECAP: Established in July 2000, SECAP is a consortium of leading equipment suppliers to the advanced packaging industry. Members of SECAP are Semitool (Nasdaq: SMTL), Suss MicroTec, Image Technology, Matrix Integrated Systems, NEXX Systems, EKRA, and BTU International and the Fraunhofer Institute for Reliability and Microintegration (IZM) in Berlin. SECAP addressed challenges in semiconductor packaging, such as the development and validation of process equipment for the industry's conversion to wafer level packaging and 300 mm wafer technology. Within the consortium, the Fraunhofer Institute (IZM) in Berlin acted as a consultant and technical link between the equipment suppliers to identify specific equipment requirements.