Dow Corning and SUSS MicroTec Collaborating on Temporary Bonding Solution for Semiconductor Packaging

Midland, Michigan, USA and Garching, Germany: Dow Corning, a leading supplier of advanced silicon technology and materials to the semiconductor industry, and SUSS MicroTec, a leading supplier of semiconductor processing equipment, announced their collaboration on a temporary bonding solution for 3D through-silicon via (TSV) semiconductor packaging. As part of this non-exclusive agreement, the companies are developing a material and equipment system solution for high volume manufacturing of 3D TSV packaged devices. Through the collaboration, Dow Corning and SUSS MicroTec are working to overcome the challenges the market is facing in advancing 3D TSV and 3D wafer level packaging (WLP) commercialization.  

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process. Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods, provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Enabling commercialization of TSV technology will allow semiconductor companies to reduce the form factor of semiconductor packages to meet continued consumer demand for smaller, thinner and faster electronic devices with increased functionality. Stacking two or more chips vertically using TSV technology is one of the viable ways to reduce integrated circuit (IC footprint), though requires the industry to find a solution for handling thin wafers, using temporary bonding.

“SUSS MicroTec is a recognized leader in wafer bonding and applications for 3D TSV, WLP, and microelectromechanical systems (MEMS) markets. Leveraging their equipment expertise allows Dow Corning to provide customers with access to system solutions for their complex 3D packaging requirements,” commented Jim Helwick, vice president, Dow Corning Electronics Solutions.

“We are very pleased to be collaborating with a technology and materials innovator like Dow Corning.” said Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “Working side by side with Dow Corning expedited process development and this experience will facilitate faster implementation for customers interested in using the Dow Corning and SUSS MicroTec temporary bonding materials and equipment.”

Dow Corning builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. From die encapsulants for stress relief, adhesives for sealing and bonding, or thermal interface materials for performance and reliability, Dow Corning’s well-established global infrastructure ensures reliable supply, quality and support, no matter where you are in the world.

To learn more about how Dow Corning helps you invent the future, please visit www.dowcorning.com/electronics.

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