A World Leading IDM places a follow up order for Bonding-Equipment for 300mm High-Volume Production

Garching, March 28, 2013 – SUSS MicroTecAG, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a follow up purchase order for the latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM (Integrated Device Manufacturer). The customer, who has installed SUSS MicroTec tools in 2012 already, plans to enter into a pilot production with the new systems. The bonder systems are configured to temporarily bond and debond 300mm wafers for 3D integration processes in logic and memory applications using the TMAT (Thin Materials) process and adhesive materials. Delivery of the bond cluster is expected for the second half of the fiscal year 2013.