Environment friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool
Garching, April 17, 2013 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has received a purchase order for their latest generation laser ablation stepper from a leading US-American IDM (Integrated Device Manufacturer). This important sale re-states the increasing importance of this technology in advanced packaging, adding to the recent shipments of the same platform to another IDM and a major Asian OSAT (Outsourced Assembly and Test Foundry). This ELP300 Excimer laser platform is designed for high volume manufacturing and processing of wafer sizes between 200 and 300mm, employing Excimer laser technology to directly create microstructures in lieu of traditional photolithography and wet etch approaches. The advantage of this system is the ability to not only address the challenges in manufacturing next generation semiconductor packages, but also address a means to lower manufacturing costs. This technology is environment friendly as it eliminates the need for wet etching process steps utilizing toxic materials. Shipment of this system is scheduled for Q4 2013.
“The placement of the order underpins the rising importance of this new and innovative structuring technology for the semiconductor mid- and backend.”, says Frank P. Averdung, President and CEO of SUSS MicroTec. “We see high growth potential for this technology, especially in our core market of advanced packaging. Besides offering a considerable cost savings potential, this “green” Excimer laser processing technology will enable our customers the ability to design and produce even more powerful microchips and packages in the future while reducing the burden on the environment.”