Ad hoc Release: Refocusing of the Permanent Bonding Product Line
Garching, May 7, 2013 - SÜSS MicroTec AG, a global supplier of equipment and process solutions for the semiconductor industry and related markets announces a strategic repositioning of the permanent bonding product line today. The management board of SÜSS MicroTec has decided to focus permanent bonding on MEMS and LED applications to address the unsatisfying earnings level of this product line. With this step SÜSS MicroTec takes into account the technological advancement of the product portfolio and the market developments of the recent years. In connection with these measures a non-cash adjustment of EUR 6.8 million in the second quarter 2013 will be necessary. The write-offs are on capitalized development costs, which originate from the years prior to 2008, as well as on no longer needed demonstration tools and inventories. The future growth of the Substrate Bonder division will mainly be driven by the product line Temporary Bonding which has been successfully established in the market. The sales contribution of the Permanent Bonding product line will for the time being remain at the level of the previous year. With these changes the Substrate Bonder division of SÜSS MicroTec is well positioned to benefit from the expected growth in the target markets 3D IC, MEMS and LED in the years to come.
The management board of SÜSS MicroTec reiterates the sales expectation of approximately EUR 150 million for the fiscal year 2013. Due to the write-offs, SÜSS MicroTec now expects a negative EBIT in the mid-to-high single digit million Euro range for the fiscal year 2013.