3D Integration / Advanced Packaging

3D Packaging provides performance, size and cost advantages for a very wide range of applications. The process technologies required for a 3D packaging approach are for the most part available. With process yields and device reliability still in the process of optimization the “2.5D” technology comes in as a process and device integration technology. Most commonly referred to as interposer technology the device stacking is done side by side on an interposer substrate. Many of the advantages of 3D Packaging technology can be realized with the interposer approach without the challenges of stacking devices on top of each. Stacking die may lead to concerns about stack temperature whereas the side by side approach has very little to no impact on the temperature of each die.

Both the 2.5D and 3D stacking technologies will require handling of thinned wafers on carriers. The XBS300 and XBC300 high volume temporary bonders and debonders meet the process requirements for wafers thinned to 20 microns and wafer diameters up to 300mm.