3D Stacking

Stacking is one of the key enabling 3D interconnect technologies for the 3D integration market. Stacking can be done at the die or wafer level.

For stacking a variety of wafer level bonding methods exists, all of which can be performed in the SUSS MicroTec XBC300 Wafer Bonder. New trends in the manufacturing of low-cost CMOS camera systems require the assembly of Opto-Wafers on wafer level (i.e. Wafer Level Cameras). For this specific UV-Bonding application the SUSS Mask Aligner platform like the MA200Compact and MA/Ba8 Gen3 are the systems of choice.