Wafer Level Optics

Wafer-level cameras (WLCs) can be found nowadays in almost every cellphone as well as in other portable devices such as tablets and laptops. Such cameras consist of two main components: the CMOS image sensor and the wafer level optics (WLO). Microlenses are key components in the optical systems. To ensure high output and at the same time low manufacturing costs, packaging of the optical modules takes place at wafer level instead of for the individual modules.

SUSS MicroTec supports two important steps at wafer level within the process for manufacturing optical modules:

  • Microlens imprinting using UV replication
  • Bonding

 

UV Replication

To imprint and transfer microlenses, a soft stamp mounted on a glass carrier is pressed into resist. That results in deformations that are then hardened using UV light. Gapsetting is actively controlled to ensure uniform imprinting. It is recommended that imprint tools include a means of inserting a buffer wafer that acts as a bridging layer for active surfaces at the backside of the wafer. This allows to produce lenses on both sides of the wafer.

Process Technologies

TechnologyProduct
Spin Coater, Spray Coater
Mask Aligner
MA/BA8 Gen3, MA200Compact

UV Bonding

Following UV replication, the lens wafers are stacked using spacer wafers as buffer between lens wafers. UV bonding is required for this step.

Process Technologies

TechnologyProduct
MA/BA8 Gen3, MA200Compact

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