Wafer Level Optics
Wafer-level cameras (WLCs) can be found nowadays in almost every cellphone as well as in other portable devices such as touchpads and laptops. Such cameras consist of two main components: the CMOS image sensor and the wafer-level optics (WLO). Microlenses are key components in the optical systems. To ensure high output and at the same time low manufacturing costs, packaging of the optical modules takes place at wafer-level instead of for the individual devices.
SUSS MicroTec supports two important steps at wafer-level within the process for manufacturing optics:
Microlens Imprinting with UV Replication
To imprint and transfer microlenses, a soft stamp mounted on a glass carrier is pressed into resist. The results in deformations that are then hardened using UV light. Gapsetting is actively controlled to ensure uniform imprinting. It is recommended that imprint tools include a means of inserting a buffer wafer that acts as a bridging layer for active surfaces at the backside of the wafer. This allows to produce lenses on both sides of the wafer.
Process Technologies
| Technology | Product |
|---|---|
| Spin Coater, Spray Coater | |
| Mask Aligner | |
| MA/BA8 Gen3, MA200Compact |
UV Bonding
Following UV replication, the lens wafers are stacked using spacer wafers as buffer between lens wafers. UV bonding is required for this step.
Process Technologies
| Technology | Product |
|---|---|
| MA/BA8 Gen3, MA200Compact |
Image Gallery
- Source: AWAIBA
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