Fan-Out Wafer-Level Package
Fan-out wafer-level packaging (FO WLP) represents a sort of compromise between die-level packaging and wafer-level packaging. The semiconductor wafer is diced and the singulated ICs are embedded in a new “artificial” wafer. On embedding, enough space has to be ensured between the individual dice to allow for the fan-out redistribution layer (RDL).
Unique feature: More than one die can be integrated in a single WLP by stacking.