WLCSP / RDL
Wafer-level chip-scale packages (WLCSP) are the result of packaging a complete system (i.e. microchip and housing) at wafer-level, that is, prior to singulation. Contact points within the chip can be complemented using redistribution layers (RDL). This technique allows an even more miniaturized design.
• Analog systems
|Mask Aligner, Projection Lithography Equipment|