Wafer-Level Chip-Scale Packaging

Wafer level chip scale packages (WLCSP) are the result of packaging a complete system (i.e. microchip and housing) at wafer level, that is, prior to singulation. Additional contact points within the chip can be included using redistribution layers (RDLs). This technique allows an even more miniaturized design.

Applications

  • Analog systems
  • RF
  • Wireless

Process Technologies

TechnologyProduct
Spin Coater
Mask Aligner, Projection Scanner
Developer
Excimer Laser Stepper
Wafer Bonder

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