WLCSP / RDL
Wafer-level chip-scale packages (WLCSP) are the result of packaging a complete system (i.e. microchip and housing) at wafer-level, that is, prior to singulation. Contact points within the chip can be complemented using redistribution layers (RDL). This technique allows an even more miniaturized design.
Applications
• Analog systems
• RF
• Wireless
Process Technologies
| Technology | Product |
|---|---|
| Spin Coater | |
| Mask Aligner, Projection Lithography Equipment | |
| Developer | |
| ELP300 | |
| Wafer Bonder |
Product Finder & Contact
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Remanufactured Equipment
Contact
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