Automated Alignment Verification System
DSM200 Gen2
Fully Automated Top-to-Bottom Side Alignment Verification System
With the DSM200 Gen2 SUSS MicroTec introduces the automated metrology tool of choice for all emerging front to backside alignment and overlay applications. The front-to-back alignment verification system is the ideal tool for measuring alignment accuracy on wafers from 2 inch to 200mm.
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