Excimer Laser Processing System

Excimer Laser Stepper ELP300 Gen2

SUSS MicroTec’s ELP300 platform for wafer sizes between 200 and 300 mm employs the latest excimer laser stepper technology. Thanks to the mask based ablation technique and non-thermal dry etching processing (248 / 308 nm), the system offers an exceptional level of patterning precision and throughput.

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