Lithography Cluster for Wafer Level Packaging

The LithoPack300 Gen2 (LP300) lithography cluster consists of an MA300 Gen2 mask aligner module linked to an ACS300 Gen2 spin-coating system. The LP300 Gen2 is specifically designed for flip-chip and wafer level packaging applications on 200/300 mm wafers. The LP300 Gen2 allows quick change over from 300 mm to 200 mm wafers and is an attractive solution not only to mass manufacturers of 300 mm packaging applications but also to wafer bumping service providers with only limited volumes of 300 mm wafers.


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